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USB 2.0 High-Speed x 2 Channels/Stereo Audio Dual SP3T (Dual 3 to 1 Multiplexer)
ISL54214
The Intersil ISL54214 is a single supply dual SP3T analog switch that operates from a single supply in the range of 2.7V to 4.6V. It was designed to multiplex between audio stereo signals and two different USB 2.0 high speed differential data signals. The audio channels allow signal swings below ground, allowing the multiplexing of the voice and data signals through a common headphone connector in Personal Media Players and other portable battery powered devices. The audio switch cells can pass 1V ground referenced audio signals with very low distortion (<0.03% THD+N when driving 5mW into 32 loads). The USB switch cells have very low ON capacitance (8pF) and high bandwidth to pass USB high speed signals (480Mbps) with minimal edge and phase distortion. The ISL54214 is available in a tiny 12 Ld 2.2mmx1.4mm ultra-thin QFN and 12 Ld 3mmx3mm TQFN packages. It operates over a temperature range of -40 to +85C.
ISL54214
Features
* High Speed (480Mbps) and Full Speed (12Mbps) Signaling Capability per USB 2.0 * Low Distortion Negative Signal Capability Audio Switches * Power OFF Protection * COM Pins Overvoltage Tolerant to 5.5V * Low Distortion Headphone Audio Signals - THD+N at 5mW into 32 Load . . . . . . . . <0.03% * Cross-talk (100kHz) . . . . . . . . . . . . . . . . . . -98dB * OFF-Isolation (100kHz) . . . . . . . . . . . . . . . 95.5dB * Single Supply Operation (VDD) . . . . . . 2.7V to 4.6V * -3dB Bandwidth USB Switches. . . . . . . . . . . 700MHz * Available in Tiny 12 Ld TQFN and TQFN Packages * Compliant with USB 2.0 Short Circuit Requirements Without Additional External Components * Pb-Free (RoHS Compliant)
Related Literature
* Technical Brief TB363 "Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)"
Applications
* MP3 and other Personal Media Players * Cellular/Mobile Phone
Application Block Diagram
3.3V CONTROLLER VDD ISL54214 LOGIC CONTROL 4M 2DUSB HIGH-SPEED TRANSCEIVER 2D+ COM -
C0 C1 VBUS
AUDIO CODEC USB HIGH-SPEED TRANSCEIVER
L R 1D1D+ 50k GND 50k
COM +
1k
1k
June 28, 2010 FN6816.3
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2008-2010. All Rights Reserved All other trademarks mentioned are the property of their respective owners.
USB/HEADPHONE JACK
ISL54214
State Diagram
0 ALL 00 10 SWITCHES OFF 00 01 00
0
00 1 01 0
USB2 10
11
00
AUDIO MUTE
USB1 01
10
11
INTERNAL REGISTER VALUE WHEN TRANSISTIONED INTO THIS STATE 11 1
11 AUDIO 11 01
Truth Table
CURRENT CODE C1 0 0 1 1 1 1 1 1 C0 0 1 0 0 0 1 0 0 LAST CODE C1 X X 0 0 1 X 1 1 C0 X X 0 1 0 X 0 1 MODE ALL SWITCHES OFF USB1 USB2 USB2 USB2 AUDIO MUTE MUTE SHUNT SWITCHES 1k COM SHUNTS OFF OFF OFF OFF OFF OFF ON ON REGISTER 0 0 0 0 0 1 1 1
C0, C1: Logic "0" when 0.5V or float, Logic "1" when 1.4V with VDD in range of 2.7V to 3.6V.
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ISL54214
Pin Configurations
ISL54214 (12 LD 2.2x1.4 TQFN) TOP VIEW
2D12 VDD 11 C0 10 PD 2D+ 1 LOGIC CONTROL 9 C1 LOGIC CONTROL
ISL54214 (12 LD 3x3 TQFN) TOP VIEW
2D12 VDD 11 C0 10
2D+
1
9
C1
L
2
8
COM -
L
2
8
COM -
R
3
7
COM +
R
3
7
COM +
4 1D-
5 1D+
6 GND
4 1D-
5 1D+
6 GND
NOTE: 1. ISL54214 Switches Shown for C1 = Logic "1" and C0 = Logic "1". The R and L 50k pull-down resistors, C1 and CO 4M pull-down resistors and COM- and COM+ 1k Shunts are not shown.
Pin Descriptions
TQFN 1 2 3 4 5 6 7 TQFN 1 2 3 4 5 6 7 NAME 2D+ L R 1D1D+ GND COM+ FUNCTION USB2 Differential Input Audio Left Input Audio Right Input USB1 Differential Input USB1 Differential Input Ground Connection Voice and Data Common Pin
Pin Descriptions
TQFN 8 9 10 11 12 TQFN 8 9 10 11 12 NAME COMC1 C0 VDD 2DPD
(Continued) FUNCTION Voice and Data Common Pin Digital Control Input Digital Control Input Power Supply USB2 Differential Input Thermal Pad. Tie to Ground or Float (TQFN only)
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Ordering Information
PART NUMBER (Note 5) ISL54214IRUZ-T (Note 2, 3) ISL54214IRTZ (Note 4) ISL54214IRTZ-T (Notes 2, 4) ISL54214EVAL1Z NOTES: 2. Please refer to TB347 for details on reel specifications. 3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 4. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 5. For Moisture Sensitivity Level (MSL), please see device information page for ISL54214. For more information on MSL please see techbrief TB363. PART MARKING GJ 4214 4214 TEMP. RANGE (C) -40 to +85 -40 to +85 -40 to +85 PACKAGE (Pb-Free) 12 Ld 2.2mmx1.4mm TQFN (Tape and Reel) 12 Ld 3mmx3mm TQFN 12 Ld 3mmx3mm TQFN (Tape and Reel) PKG. DWG. # L12.2.2x1.4A L12.3x3A L12.3x3A
Evaluation Board
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Absolute Maximum Ratings
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . Input Voltages 1D+, 1D-, L, R, 2D+, 2D-. . . . . . . . . . . . C0, C1 (Note 6). . . . . . . . . . . . . . . . . . . Output Voltages COM-, COM+ . . . . . . . . . . . . . . . . . . . . Continuous Current (L, R) . . . . . . . . . . . . . Peak Current (L, R) (Pulsed 1ms, 10% Duty Cycle, Max) . . . . Continuous Current (1D-, 1D+, 2D-, 2D+) . Peak Current (1D-, 1D+, 2D-, 2D+) (Pulsed 1ms, 10% Duty Cycle, Max) . . . . ESD Rating: Human Body Model . . . . . . . . . . . . . . . . Machine Model . . . . . . . . . . . . . . . . . . . Charged Device Model . . . . . . . . . . . . . . Latch-up Tested per JEDEC; Class II Level A . . -0.3V to 5.5V . . . -2V to 5.5V . . -0.3V to 5.5V . . . -2V to 5.5V . . . . . . 60mA . . . . . 120mA . . . . . . 40mA . . . . . 100mA . . . . . . . . . . . . . . . . . . . . . . . . . . >5kV . >500V . . >2kV at 85C
Thermal Information
Thermal Resistance (Typical) JA (C/W) JC (C/W) 12 Ld TQFN Package (Note 7, 8) . 155 90 12 Ld TQFN Package (Notes 9, 10) . 58 1.0 Maximum Junction Temperature (Plastic Package). . +150C Maximum Storage Temperature Range. . . . . -65C to +150C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . -40C to +85C Supply Voltage Range . . . . . . . . . . . . . . . . . . 2.7V to 4.6V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty.
NOTES: 6. Signals on C1 and C0 exceeding GND by specified amount are clamped. Limit current to maximum current ratings. 7. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 8. For JC, the "case temp" location is taken at the package top center. 9. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with "direct attach" features. See Tech Brief TB379. 10. For JC, the "case temp" location is the center of the exposed metal pad on the package underside.
Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: VDD = +3.0V, GND = 0V, VC0H, VC1H = 1.4V, VC0L,
VC1L = 0.5V, (Note 11), Unless Otherwise Specified. MAX MIN (Notes TEMP (Notes (C) 12, 13) TYP 12, 13) UNITS
PARAMETER ANALOG SWITCH CHARACTERISTICS Audio Switches (L, R) Analog Signal Range, VANALOG ON-Resistance, rON
TEST CONDITIONS
VDD = 3.0V to 3.6V, Audio Mode (C0 = VDD, C1 = VDD) VDD = 3.0V, Audio Mode (C0 = 1.4V, C1 = 1.4V), ICOMx = 60mA, VL or VR = -0.85V to 0.85V, (See Figure 3, Note 15)
Full +25 Full +25 Full
-1.5 -
2.3 0.04 0.03 -
1.5 2.8 3.4 0.25 0.26 0.05 0.07
V
rON Matching Between Channels, VDD = 3.0V, Audio Mode (C0 = 1.4V, C1 = 1.4V), rON ICOMx = 60mA, VL or VR = Voltage at max rON over signal range of -0.85V to 0.85V, (Notes 15, 16) rON Flatness, rFLAT(ON)
VDD = 3.0V, Audio Mode (C0 = 1.4V, C1 = 1.4V), +25 ICOMx = 60mA, VL or VR = -0.85V to 0.85V, (Notes 14, 15) Full
USB/DATA Switches (1D+, 1D-, 2D+, 2D-) Analog Signal Range, VANALOG ON-Resistance, rON VDD = 2.7V to 4.6V, USB1 mode (C0 = 0V, C1 = VDD) or USB2 Mode (C0 = VDD, C1 = 0V) VDD = 2.7V, USB1 mode (C0 = 0.5V, C1 = 1.4V) or USB2 Mode (C0 = 1.4V, C1 = 0.5V), ICOMx = 40mA, VD+ or VD-= 0V to 400mV (See Figure 4, Note 15) Full 25 Full 25 Full -1 6.2 0.08 VDD 8 10 0.5 0.55 V
rON Matching Between Channels, VDD = 2.7V, USB1 mode (C0 = 0.5V, C1 = 1.4V) or USB2 rON Mode (C0 = 1.4V, C1 = 0.5V), ICOMx = 40mA, VD+ or VD-= Voltage at max rON, (Notes 15, 16)
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Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: VDD = +3.0V, GND = 0V, VC0H, VC1H = 1.4V, VC0L,
VC1L = 0.5V, (Note 11), Unless Otherwise Specified. (Continued) MAX MIN (Notes TEMP (Notes (C) 12, 13) TYP 12, 13) UNITS 25 Full +25 Full 25 Full 25 Full -15 -20 -20 -25 0.26 9.8 0.11 2.4 1 1.2 20 25 15 20 20 25 nA nA nA nA
PARAMETER rON Flatness, rFLAT(ON)
TEST CONDITIONS VDD = 2.7V, USB1 mode (C0 = 0.5V, C1 = 1.4V) or USB2 Mode (C0 = 1.4V, C1 = 0.5V), ICOMx = 40mA, VD+ or VD- = 0V to 400mV, (Notes 14, 15) VDD = 3.3V, USB1 mode (C0 = 0.5V, C1 = 1.4V) or USB2 Mode (C0 = 1.4V, C1 = 0.5V), ICOMx = 40mA, VD+ or VD- = 3.3V (See Figure 4, Note 15) VDD = 3.6V, All OFF Mode (C0 = 0.5V, C1 = 0.5V), VCOMor VCOM+ = 0.5V, 0V, VD+ or VD- = 0V, 0.5V, L = R = float VDD = 3.3V, USB1 mode (C0 = 0.5V, C1 = 1.4V) or USB2 Mode (C0 = 1.4V, C1 = 0.5V), VD+ or VD- = 2.7V, COM- = COM+ = Float, L and R = float
ON-Resistance, rON
OFF Leakage Current, ID+(OFF) or ID-(OFF) ON Leakage Current, IDX
DPDT DYNAMIC CHARACTERISTICS All OFF to USB or USB to All OFF VDD = 2.7V, RL = 50, CL = 10pF, (see Figure 1) Address Transition Time, tTRANS Audio to USB1 Address Transition VDD = 2.7V, RL = 50, CL = 10pF, (see Figure 1) Time, tTRANS Break-Before-Make Time Delay, tD Skew, (tSKEWOUT - tSKEWIN) VDD = 3.6V, RL = 50, CL = 10pF, (see Figure 2) VDD = 3.0V, USB1 mode (C0 = 0V, C1 = VDD) or USB2 Mode (C0 = VDD, C1 = 0V), RL = 45, CL = 10pF, tR = tF = 500ps at 480Mbps, (Duty Cycle = 50%) (see Figure 7) VDD =3.0V, USB1 mode (C0 = 0V, C1 = VDD) or USB2 Mode (C0 = VDD, C1 = 0V), RL = 50, CL = 10pF, tR = tF = 500ps at 480Mbps VDD = 3.0V, USB1 mode (C0 = 0V, C1 = VDD) or USB2 Mode (C0 = VDD, C1 = 0V), RL = 45, CL = 10pF, (see Figure 7) VDD = 3.0V, Audio Mode (C0 = VDD , C1 = VDD), RL = 32, f = 20Hz to 20kHz, VR or VL = 0.707VRMS (see Figure 6) VDD = 3.0V, RL = 50, f = 100kHz VDD = 3.0V, RL = 50, f = 100kHz VDD = 3.0V, C0 = 0V, C1 = 0V, RL = 32, f = 20Hz to 20kHz VDD = 3.0V, C1 = VDD , C0 = 0V, RL = 32, f = 20Hz to 20kHz VDD = 3.0V, C1 = VDD , C0 = 0V, RL = 20k, f = 20Hz to 20kHz f = 20Hz to 20kHz, VDD = 3.0V, C0 = VDD, C1 = VDD, L or R = 0.707VRMS (2 VP-P), RL = 32 f = 20Hz to 20kHz, VDD = 3.0V, C0 = VDD, C1 = VDD, 5mW into RL = 32 Signal = 0dBm, 0.2VDC offset, RL = 50, CL = 5pF Signal = 0dBm, RL = 50, CL = 5pF 25 25 25 25 175 12 52 75 ns s ns ps
Total Jitter, tJ
25
-
210
-
ps
Rise/Fall Degradation (Propagation Delay), tPD Audio Crosstalk R to COM-, L to COM+ Crosstalk (Audio to USB, USB to Audio) OFF-Isolation Audio OFF-Isolation (All OFF Mode) Audio OFF-Isolation (Mute Mode) Audio OFF-Isolation (Mute Mode) Total Harmonic Distortion Total Harmonic Distortion USB Switch -3dB Bandwidth Audio Switch -3dB Bandwidth
25
-
250
-
ps
25
-
-88
-
dB
25 25 25 25 25 25 25 25 25
-
-98 95.5 115 105 77 0.045 0.025 700 330
-
dB dB dB dB dB % % MHz MHz
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ISL54214
Electrical Specifications - 2.7V to 3.6V Supply Test Conditions: VDD = +3.0V, GND = 0V, VC0H, VC1H = 1.4V, VC0L,
VC1L = 0.5V, (Note 11), Unless Otherwise Specified. (Continued) MAX MIN (Notes TEMP (Notes (C) 12, 13) TYP 12, 13) UNITS 25 25 25 25 3 5 3 8 pF pF pF pF
PARAMETER 1D+/1D- OFF Capacitance, C1D+OFF, C1D-OFF L/R OFF Capacitance, CLOFF, CROFF 2D+/2D- OFF Capacitance, C2D+OFF, C2D-OFF COM ON Capacitance, CCOM(ON), CCOM+(ON)
TEST CONDITIONS f = 1MHz, VDD = 3.0V, C0 = VDD, C1 = VDD, VD- or VD+ = VCOMx = 0V, (see Figure 5) f = 1MHz, VDD = 3.0V, C0 = 0V, C1 = VDD, L or R = COMx = 0V, (see Figure 5) f = 1MHz, VDD = 3.3V, C0 = VDD, C1 = VDD, Tx or Rx = COMx = 0V, (See Figure 5) f = 1MHz, VDD = 3.0V, USB Mode (C0 = 0V, C1 = VDD), D- or D+ = COMx = 0V, (see Figure 5)
POWER SUPPLY CHARACTERISTICS Power Supply Range, VDD Positive Supply Current, IDD (ALL OFF Mode) Positive Supply Current, IDD (USB1 Mode) Positive Supply Current, IDD (USB2 Mode) Positive Supply Current, IDD (Audio Mode) Positive Supply Current, IDD (MUTE Mode) VDD = 3.6V, C1 = GND, C0 = GND Full 25 Full VDD = 3.6V, C1 = GND, C0 = VDD 25 Full VDD = 3.6V, C1 = VDD, C0 = GND 25 Full VDD = 3.6V, Audio Mode (C0 = C1 = VDD) 25 Full VDD = 3.6V, C1 = VDD, C0 = GND 25 Full 25 25 25 2.7 6.2 6.5 6.2 9 6.6 11 5 4.6 8 15 8 15 8 15 14 20 8 15 4 V A A A A A A A A A A A A A
Power OFF COMx Current, ICOMx VDD = 0V, C0 = C1 = Float, COMx = 5.25V Power OFF Logic Current, IC0, IC1 VDD = 0V, C0 = C1 = 5.25V Power OFF D+/D- Current, IXD+, VDD = 0V, C0 = C1 = Float, XD- = XD+ = 5.25V IXDDIGITAL INPUT CHARACTERISTICS C0, C1 Voltage Low, VC0L, VC1L VDD = 2.7V to 3.6V
Full Full Full Full Full
1.4 -50 -2 -
6.2 1.6 4
0.5 5.25 50 2 -
V V nA A M
C0, C1 Voltage High, VC0H, VC1H VDD = 2.7V to 3.6V C0, C1 Input Current, IC0L, IC1L VDD = 3.6V, C0 = C1 = 0V or Float C0, C1 Input Current, IC0H, IC1H VDD = 3.6V, C0 = C1 = 3.6V C0, C1 Pull-Down Resistor, RCx NOTES: 11. Vlogic = Input voltage to perform proper function. VDD = 3.6V, C0 = C1 = 3.6V, Measure current into C0 or C1 pin and calculate resistance value.
12. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet. 13. Parameters with MIN and/or MAX limits are 100% tested at +25C, unless otherwise specified. Temperature limits established by characterization and are not production tested. 14. Flatness is defined as the difference between maximum and minimum value of on-resistance over the specified analog signal range. 15. Limits established by characterization and are not production tested. 16. rON matching between channels is calculated by subtracting the channel with the highest max rON value from the channel with lowest max rON value, between L and R or between 1D+ and 1D- or between 2D+ and 2D-.
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Test Circuits and Waveforms
VC0,C1 LOGIC INPUT VC0,C1 50% tOFF SWITCH V INPUT INPUT 90% SWITCH OUTPUT 0V tON VOUT 90% LOGIC INPUT tr < 20ns tf < 20ns VINPUT SWITCH INPUT C0, C1 GND RL 50 CL 10pF COMx VDD C
VOUT
Logic input waveform is inverted for switches that have the opposite logic sense.
Repeat test for all switches. CL includes fixture and stray capacitance. RL ----------------------V OUT = V (INPUT) R + r L ON FIGURE 1B. ADDRESS tTRANS TEST CIRCUIT
FIGURE 1A. ADDRESS tTRANS MEASUREMENT POINTS
FIGURE 1. SWITCHING TIMES
VDD
C
LOGIC INPUT
VC0 VINPUT VC1 VOUT 0V
2D- OR 2D+ 1D- OR 1D+ L OR R C0, C1 90% tD LOGIC INPUT GND COMx RL 50 VOUT CL 10pF
SWITCH OUTPUT
Repeat test for all switches. CL includes fixture and stray capacitance. FIGURE 2A. MEASUREMENT POINTS FIGURE 2B. TEST CIRCUIT
FIGURE 2. BREAK-BEFORE-MAKE TIME
VDD C
VDD C
rON = V1/60mA COMx VL OR VR C0 V1 40mA L OR R GND C1 VC0H VC1H
rON = V1/40mA D- OR D+ VD- OR VD+ C0 V1 40mA COMx GND C1 0V VDD
Repeat test for all switches. FIGURE 3. AUDIO rON TEST CIRCUIT
Repeat test for all switches. FIGURE 4. USB rON TEST CIRCUIT
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Test Circuits and Waveforms (Continued)
VDD C VDD C
CTRL AUDIO OR USB SIGNAL GENERATOR
CTRL L OR R COMx 32
IMPEDANCE ANALYZER COMx GND
VCx VCxL OR VCxH ANALYZER 32 0V OR FLOAT
VCx
COMx GND
R OR L
N.C.
Repeat test for all switches.
FIGURE 5. CAPACITANCE TEST CIRCUIT FIGURE 6. AUDIO CROSSTALK TEST CIRCUIT
VDD tri 90% DIN+ DIN10% 50% tskew_i 90% DIN+ 50% 10% tfi tro 90% OUT+ OUT10% 50% tskew_o 90% tf0 50% 10% GND DIN143 15.8 143 COM0V VDD 15.8 C0 C1 COM+ VDD
C
D+ CL DCL
OUT+ 45 OUT45
|tro - tri| Delay Due to Switch for Rising Input and Rising Output Signals. |tfo - tfi| Delay Due to Switch for Falling Input and Falling Output Signals. |tskew_0| Change in Skew through the Switch for Output Signals. |tskew_i| Change in Skew through the Switch for Input Signals.
FIGURE 7A. MEASUREMENT POINTS FIGURE 7. SKEW TEST
FIGURE 7B. TEST CIRCUIT
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Application Block Diagrams
3.3V CONTROLLER
VDD ISL54214 LOGIC CONTROL
C0 4M C1 VBUS
USB HIGH-SPEED TRANSCEIVER #2 AUDIO CODEC USB HIGH-SPEED TRANSCEIVER #1 OR UART TRANSCEIVER
2D2D+ COM -
L R 1D1D+ 50k GND 50k
COM +
1k
1k
Detailed Description
The ISL54214 device consists of dual SP3T (single pole/triple throw) analog switches. It operates from a single DC power supply in the range of 2.7V to 4.6V. It was designed to function as differential 3 to 1 multiplexer to select between two different USB differential data signals and audio L and R stereo signals. Its offered in tiny TQFN and TQFN packages for use in MP3 players, PDAs, cellphones, and other personal media players. A device consists of two 2.3 audio switches and four 6.2 USB switches. The audio switches can accept signals that swing below ground. They were designed to pass audio left and right stereo signals, that are ground referenced, with minimal distortion. The USB switches were designed to pass high-speed USB differential data signals with minimal edge and phase distortion. The ISL54214 was specifically designed for MP3 players, personal media players and cellphone applications that need to combine the stereo audio and USB channels into a single shared connector, thereby saving space and component cost. The Typical application block diagram of this functionality is previously shown. The ISL54214 contains two logic control pins (C1 and C0) that determine the state of the device. The part has the following five states or modes of operation: All SWITCHES OFF; USB1; USB2; Audio; and Audio Mute. These states are discussed in detail in "Logic Control" on page 11. A detailed description of the various types of switches is provided in the following sections.
Audio Switches
The two audio switches (L, R) are 2.3 switches that can pass signals that swing below ground. Over a signal range of 1V (0.707VRMS) with VDD > 2.7V, these switches have an extremely low rON resistance variation. They can pass ground referenced audio signals with very low distortion (<0.05% THD+N) when delivering 15.6mW into a 32 headphone speaker load. See Figures 16, 17, 18, 19 and 20 THD+N performance curves. Crosstalk between the L and R audio switches over the frequency range of 20Hz to 20kHz when driving a 32 load is < -88dB. These switches have excellent off-isolation > 105dB over the audio band when connected to 32 loads and 77dB when connected to 20k loads (In Audio Mute mode). See Figures 21 and 22 in "Typical Performance Curves" section. The audio drivers should be connected at the L and R side of the switch (pins 2 and 3) and the speaker loads should be connected at the COM side of the switch (pins 7 and 8). The audio switches are active (turned ON) whenever the C1 and C0 logic pins are logic "1" (High).
USB Switches
The four USB switches (1D+, 1D-, 2D+, 2D-) are 6.2 bidirectional switches that were specifically designed to pass high-speed USB differential data signals in the range of 0V to 400mV. The switches have low capacitance and high bandwidth to pass USB high-speed signals (480Mbps) with minimum edge and phase distortion to meet USB 2.0 signal quality specifications. See Figures 23 and 24 for the high-speed eye pattern taken with the switch in the signal path.
FN6816.3 June 28, 2010
10
USB/HEADPHONE JACK
ISL54214
These switches can also swing rail-to-rail and pass USB full-speed signals (12Mbps) with minimal distortion. See Figure 25 for the full-speed eye pattern taken with the switch in the signal path. The maximum normal operating signal range for the USB switches is from -1V to VDD. The signal voltage at D- and D+ should not be allow to exceed the VDD voltage rail or go below ground by more than -1V for normal operation. However, in the event that the USB 5.25V VBUS voltage is shorted to one or both of the COM pins, the ISL54214 has fault protection circuitry to prevent damage to the ISL54214 part. The fault circuitry allows the signal pins (COM-, COM+, 1D-, 1D+, 2D-, 2D+, L and R) to be driven up to 5.25V while the VDD supply voltage is in the range of 0V to 4.6V. This fault condition causes no stress to the IC. In addition, when VDD is at 0V (ground), all switches are OFF and the fault voltage is isolated from the other side of the switch. When VDD is in the range of 2.7V to 4.6V, the fault voltage will pass through to the output of an active switch channel. Note: During the fault condition normal operation is not guaranteed until the fault condition is removed. The USB (1D+ and 1D-) switches are active (turned ON) whenever the C1 is logic "0" (Low) and C0 is logic "1" (High). The USB (2D+ and 2D-) switches are active (turned ON) whenever the C1 is logic "1" (High) and C0 is logic "0" (Low) provided the last state was not the Audio or Audio Mute state. ALL SWITCHES OFF Mode If the C1 pin = Logic "0" and C0 pin = Logic "0" the part will be in the ALL SWITCHES OFF mode. In this mode, the 2D- and 2D+ USB switches, the L and R audio switches and the 1D- and 1D+ USB switches will be OFF (high impedance). The 1k shunts on the COM side will be disconnected (OFF). It is recommended that when transitioning from USB1 to USB2 or from USB2 to USB1 that you always pass through the All Switches OFF state. Audio Mode If the C1 pin = Logic "1" and C0 pin = Logic "1", the part will be in the Audio mode. In Audio mode, the L (left) and R (right) 2.3 audio switches are ON, the 1D- and 1D+ 6.2 USB switches and 2D- and 2D+ 6.2 USB switches will be OFF (high impedance). The 1k shunts on the COM side of the switch will be disconnected (OFF). When a headphone is plugged into the common connector, the controller will drive the C1 and C0 logic pins "High" putting the part in the audio mode. In the Audio mode, the audio drivers of the player can drive the headphones and play music. USB1 Mode If the C1 pin = Logic "0" and C0 pin = Logic "1" the part will go into USB1 mode. In USB1 mode, the 1D- and 1D+ 6.2 switches are ON and the L and R 2.3 audio switches and 2D- and 2D+ 6.2 USB switches will be OFF (high impedance). The 1k COM shunt resistors will be disconnected (OFF). When a USB cable from a computer or USB hub is connected at the common connector, the controller will route the incoming USB signal to USB transceiver section #1 by taking the C1 pin "Low" and the C0 pin "High" putting the ISL54214 part into the USB1 mode. In USB1 mode the computer or USB hub transceiver and the MP3 player or cellphone USB transceiver #1 are connected and digital data will be able to be transmit back and forth. USB2 Mode If the C1 = Logic "1" and C0 pin = Logic "0" the part will be in the USB2 mode provided that the last state was not the Audio or Audio Mute state. In the USB2 mode, the 2D- and 2D+ 6.2 USB switches will be ON and audio switches and the 1D- and 1D+ USB switches will be OFF (high impedance). The 1k COM shunt resistors will be disconnected (OFF). When a USB cable from a computer or USB hub is connected at the common connector, the controller will route the incoming USB signal to USB transceiver section #2 by taking the C1 pin "High" and the C0 pin "Low" putting the ISL54214 part into the USB2 mode. In USB2
ISL54214 Operation
The discussion that follows will discuss using the ISL54214 in the "Application Block Diagrams" on page 10. LOGIC CONTROL The state of the ISL54214 device is determined by the voltage at the C1 pin (pin 9) and the C0 pin (pin 10). The part has five states or modes of operation. The All SWITCHES OFF mode, USB1 mode, USB2 mode, Audio mode and Audio Mute mode. Refer to the "Truth Table" on page 2 and "State Diagram" on page 2. The C1 pin and C0 pin are internally pulled low through 4M resistors to ground and can be tri-stated or left floating. The C1 pin and C0 pin can be driven with a voltage that is higher than the VDD supply voltage. They can be driven up to 5.25V with the VDD supply in the range of 2.7V to 4.6V. Driving the logic higher than the supply rail will cause the logic current to increase. With VDD = 2.7V and VLOGIC = 5.25V, ILOGIC current is approximately 5.5A. Logic Control Voltage Levels With VDD in the range of 2.7V to 3.6V the logic levels are: C1, C0 = Logic "0" (Low) when 0.5V or Floating. C1, C0 = Logic "1" (High) when 1.4V
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ISL54214
mode, the computer or USB hub transceiver and the MP3 player or cellphone USB transceiver #2 are connected and digital data will be able to be transmit back and forth. Audio MUTE Mode If the C1 pin = Logic "1" and C0 pin = Logic "0", the part will be in the Audio Mute mode provided that the last state was the Audio state. In the Audio Mute mode, the 2D- and 2D+ USB switches, the L and R audio switches and the 1D- and 1D+ USB switches will be OFF (high impedance). The 1k COM shunt resistors will be connected (ON). The 1k shunts provide 77dB of off-isolation when driving 10k to 20k amplifier inputs. The 1k COM shunt resistors are active (ON) only when in the Audio Mute mode. Logic Control Timing Between C1 and C0 The ISL54214 has a unique logic control architecture. The part has five different logic states but only two external logic control pins, C1 and C0. Refer to the "State Diagram" on page 2 and "Truth Table" on page 2. The following state transitions require both C1 and C0 logic control bits to change their logic levels in unison: All OFF(C1 = 0, C0 = 0) -----> Audio (C1 = 1, C0 = 1) Audio (C1 = 1, C0 = 1) -----> All OFF (C1 = 0, C0 = 0) Audio Mute (C1 = 1, C0 = 0) -----> USB1 (C1 = 0, C0 = 1) The delay time between these bits must be < 100ns to ensure that you directly move between these states without momentarily transitioning to one of the other states. For example, if you are going from the "All OFF" state to the "Audio" state and C0 does not go high until 100nS after C1 went high you will momentarily transition to the "USB2" state. Any signals connected at the USB2 signal lines will momentarily get passed through to the COM outputs. Delay time between C1 and C0 must be < 100ns and should be controlled by logic control drivers with well behaved monotonic transitions from High to Low and Low to High and with typical logic family rise and fall times of 1ns to 6ns. POWER The power supply connected at VDD (pin 11) provides power to the ISL54214 part. Its voltage should be kept in the range of 2.7V to 4.6V. In a typical application, VDD will be in the range of 2.7V to 4.3V and will be connected to the battery or LDO of the MP3 player or cellphone. A 0.01F or 0.1F decoupling capacitor should be connected from the VDD pin to ground to filter out any power supply noise from entering the part. The capacitor should be located as close to the VDD pin as possible.
Typical Performance Curves
2.95 2.90 2.85 2.80 rON () ICOM = 60mA
TA = +25C, Unless Otherwise Specified.
2.60 ICOM = 60mA 2.58 VDD = 3.0V VDD = 3.3V 2.54 VDD = 3.6V
2.56 rON ()
2.75 2.70 2.65 2.60 2.55 2.50 2.45 -1.5 -1.0 -0.5 VDD = 3.6V VDD = 4.6V 0 VCOM (V) 0.5 1.0 1.5 VDD = 2.7V
2.52 VDD = 4.0V 2.50 VDD = 4.6V 2.48 -1.5 -1.0 -0.5 0 VCOM (V) 0.5 1.0 1.5
FIGURE 8. AUDIO ON-RESISTANCE vs SUPPLY VOLTAGE vs SWITCH VOLTAGE
FIGURE 9. AUDIO ON-RESISTANCE vs SUPPLY VOLTAGE vs SWITCH VOLTAGE
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ISL54214
Typical Performance Curves
4.0 +85C 3.5
TA = +25C, Unless Otherwise Specified. (Continued)
18 16 14 VDD = 3.0V ICOM = 60mA
3.0 rON () rON () +25C
12 10 8 6 4 +85C +25C 2 -0.5 0 VCOM (V) 0.5 1.0 1.5 0 -1.5 -1.0 -40C -0.5 0 0.5 1.0 VCOM (V) 1.5 2.0 2.5 3.0
2.5
2.0
-40C
1.5
1.0
VDD = 3.0V ICOM = 60mA -1.5 -1.0
FIGURE 10. AUDIO ON-RESISTANCE vs SWITCH VOLTAGE vs TEMPERATURE
6.7 6.6 6.5 6.4 rON () 6.3 6.2 6.1 6.0 5.9 5.8 0 0.05 0.10 VDD = 4.6V 0.15 0.20 0.25 VCOM (V) VDD = 4.0V VDD = 3.0V VDD = 3.3V VDD = 3.3V ICOM = 40mA VDD = 2.7V
FIGURE 11. AUDIO ON-RESISTANCE vs SWITCH VOLTAGE vs TEMPERATURE
9 VDD = 2.7V ICOM = 40mA
+85C
8
7 rON ()
+25C
6 -40C 5
4
0.30
0.35
0.40
3
0
0.05
0.10
0.15 0.20 0.25 VCOM (V)
0.30
0.35
0.40
FIGURE 12. USB ON-RESISTANCE vs SUPPLY VOLTAGE vs SWITCH VOLTAGE
9 8 7 rON () 6 5 4 3 0 -40C
FIGURE 13. USB ON-RESISTANCE vs SWITCH VOLTAGE vs TEMPERATURE
16
VDD = 3.3V ICOM = 40mA
+85C
14 12 rON ()
VDD = 3.3V ICOM = 40mA
+25C
10 8 6 4 2 0
+85C
+25C
-40C
0.05
0.10
0.15 0.20 0.25 VCOM (V)
0.30
0.35
0.40
0.5
1.0
1.5 2.0 VCOM (V)
2.5
3.0
3.3
FIGURE 14. USB ON-RESISTANCE vs SWITCH VOLTAGE vs TEMPERATURE
FIGURE 15. USB ON-RESISTANCE vs SWITCH VOLTAGE vs TEMPERATURE
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ISL54214
Typical Performance Curves
0.056 0.055 0.054 0.053 THD+N (%) 0.052 0.051 0.050 0.049 0.048 0.047 0.046 20 50 100 200 500 1k 2k FREQUENCY (Hz) 5k VDD = 4.6V RLOAD = 32 VLOAD = 0.707VRMS VDD = 3.0V
TA = +25C, Unless Otherwise Specified. (Continued)
0.032 0.031 0.030 THD+N (%) 0.029 0.028 0.027 0.026 0.025 0.024 20 RLOAD = 32 PLOAD = 5mW
VDD = 2.7V VDD = 3.3V VDD = 3.6V VDD = 4.0V VDD = 4.6V
VDD = 3.6V VDD = 4V
10k
20k
50
100
200 500 1k 2k FREQUENCY (Hz)
5k
10k
20k
FIGURE 16. THD+N vs SUPPLY VOLTAGE vs FREQUENCY
0.070
FIGURE 17. THD+N vs SUPPLY VOLTAGE vs FREQUENCY
0.065
RLOAD = 32 0.065 VDD = 3V 0.060 0.055 0.050 THD+N (%) 0.045 0.040 0.035 0.030 0.025 0.020 0.015 0.010 20 100
PEAK-TO PEAK VOLTAGES AT LOAD 2.5VP-P 2VP-P 1.5VP-P THD+N (%)
0.060 0.055 0.050 0.045 0.040 0.035 0.030 0.025 0.020
RLOAD = 32 FREQ = 1kHz VDD = 3V
1.13VP-P 1VP-P 510mVP-P 1k FREQUENCY (Hz) 10k 20k
0.015 0.010 0.005 0 0.5 1.0 1.5 2.0 OUTPUT VOLTAGE (VP-P) 2.5
FIGURE 18. THD+N vs SIGNAL LEVELS vs FREQUENCY
0.09 RLOAD = 32 0.08 FREQ = 1kHz VDD = 3V 0.07 0.06 THD+N (%) 0.05 0.04 0.03 0.02 0.01 0 0 5 10 15 20 OUTPUT POWER (mW) 25 30 CROSSTALK (dB)
FIGURE 19. THD+N vs OUTPUT VOLTAGE
-60 -70 -80 -90 -100 -110 -120 -130 -140 -150 -160 -170 -180 20 100 1k FREQUENCY (Hz) 10k 20k VDD = 3V RLOAD = 32 VSIGNAL = 0.707VRMS
FIGURE 20. THD+N vs OUTPUT POWER
FIGURE 21. AUDIO CHANNEL-TO-CHANNEL CROSSTALK
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ISL54214
Typical Performance Curves
-60 -65 -70 -75 OFF- ISOLATION (dB) -80 -85 -90 -95 -100 -105 -110 -115 -120 -125 -130 20
TA = +25C, Unless Otherwise Specified. (Continued)
RL = 20k RL = 1k
RL = 32 VDD = 3.3V VSIGNAL = 0.707VRMS AUDIO MUTE MODE 100 1k FREQUENCY (Hz) 10k 20k
FIGURE 22. OFF-ISOLATION AUDIO SWITCH vs LOADING vs FREQUENCY
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FN6816.3 June 28, 2010
ISL54214
Typical Performance Curves
TA = +25C, Unless Otherwise Specified. (Continued)
VDD = 2.7V
USB NEAR END MASK
VOLTAGE SCALE (0.1V/DIV)
TIME SCALE (0.2ns/DIV)
FIGURE 23. EYE PATTERN: 480Mbps WITH USB SWITCHES IN THE SIGNAL PATH
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FN6816.3 June 28, 2010
ISL54214
Typical Performance Curves
TA = +25C, Unless Otherwise Specified. (Continued)
VDD = 2.7V
USB FAR END MASK
VOLTAGE SCALE (0.1V/DIV)
TIME SCALE (0.2ns/DIV)
FIGURE 24. EYE PATTERN: 480Mbps WITH USB SWITCHES IN THE SIGNAL PATH
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FN6816.3 June 28, 2010
ISL54214
Typical Performance Curves
TA = +25C, Unless Otherwise Specified. (Continued)
VDD = 2.7V
VOLTAGE SCALE (0.5V/DIV)
TIME SCALE (10ns/DIV)
FIGURE 25. EYE PATTERN: 12Mbps USB SIGNAL WITH USB SWITCHES IN THE SIGNAL PATH
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ISL54214
Typical Performance Curves
-20 RL = 50 VIN = 0.2VP-P to 2VP-P
TA = +25C, Unless Otherwise Specified. (Continued)
-10 RL = 50 VIN = 0.2VP-P to 2VP-P -30 NORMALIZED GAIN (dB)
-40 NORMALIZED GAIN (dB)
-60
-50
-80
-70
-100
-90
-120
-110
-140 0.001
0.01
0.1
1
10
100
500
-130 0.001
0.01
0.1
1
10
100
500
FREQUENCY (MHz)
FREQUENCY (MHz)
FIGURE 26. OFF-ISOLATION USB SWITCHES
FIGURE 27. OFF-ISOLATION AUDIO SWITCHES
1 USB SWITCH 0 NORMALIZED GAIN (dB)
Die Characteristics
SUBSTRATE AND TQFN THERMAL PAD POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 837 PROCESS: Submicron CMOS
-1
-2
-3
-4 RL = 50 VIN = 0.2VP-P to 2VP-P 1M 10M 100M FREQUENCY (Hz) 1G
-5
FIGURE 28. FREQUENCY RESPONSE
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FN6816.3 June 28, 2010
ISL54214
Revision History
DATE 6/1/10 REVISION FN6816.3 CHANGE Converted to new Intersil template. Added Revision History table and Products sections. On page 3 , added separate pin configuration diagrams for the uTQFN and TQFN parts. On page 3, updated the pin description table to show the thermal pad. On page 5, in ABS section added latch-up level. On page 7, Changed ICOMx current limit for 25C from: 1A, to: 4A. Under "Thermal Information" on page 5 for the TQFN, added theta JC TOP value of 90C/W, along with appropriate foot note for theta JC as measured on top of package.
Products
Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. *For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on intersil.com: ISL54214 To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff FITs are available from our website at http://rel.intersil.com/reports/search.php
For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com 20
FN6816.3 June 28, 2010
ISL54214
Package Outline Drawing
L12.3x3A
12 LEAD THIN QUAD FLAT NO LEAD PLASTIC PACKAGE Rev 0, 09/07
3.00 A B 6 PIN 1 INDEX AREA 9 4X 1.45 3.00 1 10 0.5 BSC 6 PIN #1 INDEX AREA
12
7 3 0.10 M C A B (4X) 0.15 6 12X 0 . 4 0 . 1 4 4 0.25 +0.05 / -0.07
TOP VIEW
BOTTOM VIEW
SEE DETAIL "X" 0.10 C BASE PLANE 1.45 ) SEATING PLANE 0.08 C
0 . 75 ( 2 . 8 TYP )
C
SIDE VIEW
(
0.6 C 0 . 2 REF 5
0 . 50 0 . 25
0 . 00 MIN. 0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal 0.05 4. Dimension b applies to the metallized terminal and is measured between 0.18mm and 0.30mm from the terminal tip. 5. Tiebar shown (if present) is a non-functional feature. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 indentifier may be either a mold or mark feature.
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FN6816.3 June 28, 2010
ISL54214 Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
D 6 INDEX AREA 2X 2X 0.10C 1 0.10C 2 A
L12.2.2x1.4A
B
12 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE MILLIMETERS SYMBOL A A1 A3 b D 0.15 2.15 1.35 MIN 0.45 NOMINAL 0.50 0.127 REF 0.20 2.20 1.40 0.40 BSC 0.20 0.35 0.40 12 3 3 0 12 0.45 0.25 2.25 1.45 MAX 0.55 0.05 NOTES 5 2 3 3 4 Rev. 0 12/06
N
E
TOP VIEW
0.10C C
E e k
A 0.05C
A1
L N Nd
SIDE VIEW
LEADS COPLANARITY
Ne NOTES:
(DATUM A) PIN #1 ID 12 e (DATUM B) NX b Nd 3 5 0.10 M A B C 0.05 M C NX L
1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd and Ne refer to the number of terminals on D and E side, respectively. 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Maximum package warpage is 0.05mm. 8. Maximum allowable burrs is 0.076mm in all directions. 9. Same as JEDEC MO-255UABD except: No lead-pull-back, "A" MIN dimension = 0.45 not 0.50mm "L" MAX dimension = 0.45 not 0.42mm. 10. For additional information, to assist with the PCB Land Pattern Design effort, see Intersil Technical Brief TB389.
L 1.50
Ne
BOTTOM VIEW
C L NX (b) 5 SECTION "C-C" CC e TERMINAL TIP (A1)
2.30
1 2 3 0.40 0.45 (12x) 0.25 (12x) 0.40
TYPICAL RECOMMENDED LAND PATTERN
10
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FN6816.3 June 28, 2010

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